美國EXTEC含鉆石微粒切割碟：有高密度和低密度兩種，直徑有76mm,102mm,127mm,152mm,178mm.高密度適合經(jīng)常切割金屬及陶瓷；低密度適合切割容易損壞的物料。
建議切割時添加冷卻液或清水可減低切割時間及增加切割度
EXTEC Diamond Wafering Blades are available in high or low concentration in 3" (76 mm), 4"(102 mm), 5" (127 mm), 6" (152 mm), 7" (178 mm) and 8” (203 mm) diameters. High concentration is designed for routine use with most metals and ceramics. Low concentration is recommended for brittle materials such as ceramics, glass, carbides and other heat
resistant materials. EXTEC EP Wafering Blades are specifically manufactured for soft and gummy materials. EXTEC I CBN (Cubic Boron Nitride) Wafering Blades are preferred for Iron and Cobalt Base Alloys, Nickel Base Super Alloys and Lead Base Alloys. DW Diamond Wafering Blades or AC Advanced Ceramic Diamond Wafering Blades come complete with a Dressing Stick. EP Diamond Wafering Blades do not require a Dressing Stick. EXTEC Universal or EXTEC Water Soluble Cutting Fluid is recommended for precision cutting and reduced cutting time.
12043 EXTEC AC Dressing Stick 1” x 1/2” x 3” (25.4 mm x 12.7 mm x 76 mm)
12045 EXTEC DW Dressing Stick 1” x 1/2” x 3” (25.4 mm x 12.7 mm x 76 mm)
12050 EXTEC Universal Cutting Fluid
12052 EXTEC Universal Cutting Fluid
12065 EXTEC Water Soluble Cutting Fluid
12067 EXTEC Water Soluble Cutting Fluid
EXTEC Diamond Wafering Blade, High Concentration
Recommended for: metal matrix composites, titanium, thermal spray coatings, printed circuit boards, bones
12200 3" Dia. x 0.006" Thickness x 1/2” Arbor (76 mm x 0.15 mm x 12.7 mm)
12205 4" Dia. x 0.012" Thickness x 1/2” Arbor (102 mm x 0.3 mm x 12.7 mm)
12210 5" Dia. x 0.015" Thickness x 1/2” Arbor (127 mm x 0.4 mm x 12.7 mm)
12215 6" Dia. x 0.020" Thickness x 1/2” Arbor (152 mm x 0.5 mm x 12.7 mm)
12220 7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm)
12218 8" Dia. x 0.035" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm)
EXTEC Diamond Wafering Blade, High Concentration
Recommended for: aggressive cutting, ferrous and non-ferrous materials
12252 5" Dia. x 0.020" Thickness x 1/2” Arbor (127 mm x 0.5 mm x 12.7 mm)
12253 7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm)
12254 8" Dia. x 0.035" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm)
EXTEC EP Diamond Wafering Blade, High Concentration
Recommended for: polymers, rubber, soft gummy materials
12222 4" Dia. x 0.012" Thickness x 1/2” Arbor (102 mm x 0.3 mm x 12.7 mm)
12224 5" Dia. x 0.015" Thickness x 1/2” Arbor (127 mm x 0.4 mm x 12.7 mm)
12226 7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm)
12228 8" Dia. x 0.035" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm)
EXTEC Diamond Wafering Blade, Low Concentration
Recommended for: ceramics, glass, alumina, zirconia, concrete, electronic substrates
12230 3" Dia. x 0.006" Thickness x 1/2” Arbor (76 mm x 0.15 mm x 12.7 mm)
12235 4" Dia. x 0.012" Thickness x 1/2” Arbor (102 mm x 0.3 mm x 12.7 mm)
12236 4" Dia. x 0.020" Thickness x 1/2” Arbor (102 mm x 0.5 mm x 12.7 mm)
12240 5" Dia. x 0.015" Thickness x 1/2” Arbor (127 mm x 0.4 mm x 12.7 mm)
12245 6" Dia. x 0.020" Thickness x 1/2” Arbor (152 mm x 0.5 mm x 12.7 mm)
12250 7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm)
12248 8" Dia. x 0.035" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm)
EXTEC Diamond Wafering Blade, Low Concentration
Recommended for: structural ceramics, boron nitride, silicon nitride
12257 5" Dia. x 0.020" Thickness x 1/2” Arbor (127 mm x 0.5 mm x 12.7 mm)
12258 7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm)
12259 8" Dia. x 0.035" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm)
EXTEC AC (Advanced Ceramic) Diamond Wafering Blade, Low Concentration
Recommended for: medium ceramics, GaAs, AIN, glass fiber composites, electron packages
12190 3" Dia. x 0.006" Thickness x 1/2” Arbor (76 mm x 0.15 mm x 12.7 mm)
12192 4" Dia. x 0.012" Thickness x 1/2” Arbor (102 mm x 0.3 mm x 12.7 mm)
12194 5" Dia. x 0.020" Thickness x 1/2” Arbor (127 mm x 0.5 mm x 12.7 mm)
12196 7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm)
12198 8" Dia. x 0.025" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm)
EXTEC Diamond Wafering Blade, Low Concentration
Recommended for: soft friable ceramics, composites with fine reinforcing media CaF, MgF, carbon composites
12193 3" Dia. x 0.006" Thickness x 1/2” Arbor (76 mm x 0.15 mm x 12.7 mm)
12195 5" Dia. x 0.015" Thickness x 1/2” Arbor (127 mm x 0.4 mm x 12.7 mm)
EXTEC I CBN (Cubic Boron Nitride) Wafering Blade, Low Concentration
Recommended for: iron and cobalt based allows, nickel based super alloys and lead based alloys
12345 3" Dia. x 0.006" Thickness x 1/2” Arbor (76 mm x 0.15 mm x 12.7 mm)
12350 4" Dia. x 0.012" Thickness x 1/2” Arbor (102 mm x 0.3 mm x 12.7 mm)
12355 5" Dia. x 0.015" Thickness x 1/2” Arbor (127 mm x 0.4 mm x 12.7 mm)
12260 6" Dia. x 0.020" Thickness x 1/2” Arbor (152 mm x 0.5 mm x 12.7 mm)
12265 7" Dia. x 0.025" Thickness x 1/2” Arbor (178 mm x 0.6 mm x 12.7 mm)
12268 8" Dia. x 0.035" Thickness x 1/2” Arbor (203 mm x 0.9 mm x 12.7 mm)
美國EXTEC研磨切割碟 ABRASIVE CUT-OFF WHEELS
樣品切割碟，邊緣以優(yōu)質(zhì)的材料制成，附設(shè)直徑6''(152mm)7''(178mm)9''(229mm)10''(254mm)12''(305mm)14''(356mm)。切割堅硬，中等硬度，較軟的金屬，含鐵合金及鋼時，建議使用氧化鋁 (Al2O3)切割碟，碳化硅 (SiC)切割碟適用于中等硬度及較軟而不含鐵的金屬，堅硬而不含金屬的混合物，鈦合金及制陶等
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